Touch Screen Rigid-Flex Printed Circuit Boards Stiffener Polyimide 1 OZ Copper FPC Flexible printed circuit-1 manufacturer from China Shenzhen Hengda Electronics Limited

Touch Screen Rigid-Flex Printed Circuit Boards Stiffener Polyimide 1 OZ Copper FPC

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: Flexible printed circuit-1

Touch Screen Rigid-Flex Printed Circuit Boards Stiffener Polyimide 1 OZ Copper FPC Quick Det

Touch Screen Rigid-Flex Printed Circuit Boards Stiffener Polyimide 1 OZ Copper FPC

Quick Details

PCB Type:	Flexible Printed Circuit
Layer :	2 layer
Min .Line Width/Space:	3mil/3mil
Min. Via Diameter:	0.3mm
Finish Thickness:	1.2mm
Surface Finish:	ENIG
Size:	60*100MM
Material:	PI
Color:	Gold
Application:	Touch Screen

Description

Shenzhen Hengda Electronics is a leading manufacturer of precision Flexible Printed Circuit (FPC) for customers worldwide. We specialize in quick-turn FPC prototypes to FPC mass productions, provide high quality and cost effective turn key solutions to our customers.

This table lists the standard flex circuits materials and material thicknesses that we may have daily available. If the material or thickness you require is not listed, consult us. We have full specification of each material available for your required.

FPC Materials

Material Function	Material Type	Options
Flexible Insulator	Polyimide(PI)	1/2 mil to 5 mil
Conductor	Copper Rolled Annealed(RA) Electrodeposited(ED)	1/4 oz(0.009mm) to 10 oz(0.356mm)
Rigid Substrate (Rigid-Flex)	FR-4	3 mil to 125 mil
Adhesive	Acrylic Adhesive	1/2 mil to 3 mil
Adhesive	Adhesiveless Material also available
Stiffener	FR-4 Polyimide(PI) Polyester(PET) Adhesivetape Steel/Aluminum/Copper	3mil to 125 mil 1/2 mil to 5mil 1 mil to 15mil 6 mil
Solder Mask	Polyimide(PI) PhotoimageableCoverlay Liquid Photoimageable Covercoat	1/2 mil to 5 mil 1 mil to 2.5 mil Liquid Typically for surface mount and dense applications
Surface Finish Options	Tin	Immersion Tin
	Gold	Electrolytic Nickel Immersion Gold Electrolytic Hard Nickel /Gold Electrolytic Soft Nickel/Gold
	Silver	Immersion Silver
	OSP	OSP
Shielding	Solid Copper Crosshatched Copper Conductive Silver Aluminum	Required To Limited Electromagnetic and/or Electrostatic

FPC Standard Structure

Technical Capabilities

Layer (Max)	Up to 8 Layers
Board Size (Max)	500*1000mm
Outer tolerance	a+/-0.2mm Hand Trim b+/-0.25mm steel Rule Dies c+/-0.07mm Punch and Dies d+/-0.025 Laser Cut
Hole	Diameter(Min)	0.1mm(Finished)
	Diameter Tolerance	a.Plating Through Holes+/-0.08mm b.Non-Plating Through Holes+/-0.05mm
	Drill Position Tolerance	+/-0.076mm
Conductor	Width Tolerance	+/-15%
	Spacing(Min)	2mil
	Spacing Tolerance	+/-15%
Pad	Pad(Non-Wiring)	>=0.04mm+ Hole
Pad	Pad(Wiring)	>=0.3mm+Hole
Coverlay	Coverlay to Pad(Min)	100um
	Coverlay to Conductor (Min)	100um
	Coverlay Width(Min)	250um
Stiffener holes	>=0.25mm+Access hole

FPC Application

Testing Procedures

We perform multiple quality assurance procedures before shipping out any PCB board. These include:

Visual Inspection
Flying probe
Bed of nails
Impedance control
Solder-ability detection
Digital metallograghic microscope
AOI (Automated Optical Inspection)

Quick turn lead times

For HDI PCB production, we can provid 7 to10 days turn around times. For multilayer PCBs, the fastestturnaround time depends on the number of layers and quantity.

Service Guarantee

We make sure to serve each customer professionally, truthfully and friendly to the best of our ability. We will gladly re-work your project if your project isn’t 100% satisfactory.

Get a quick quote now

By sending in a bill of material, ge