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RoHS PCB Rigid-Flex Circuit Boards 0.2MM Thickness , 4 Layer Surface Mount PCB Assembly 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: Flexible printed circuit-13

 
 
RoHS PCB Rigid-Flex Circuit Boards 0.2MM Thickness , 4 Layer Surface Mount PCB Assembly
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RoHS PCB Rigid-Flex Circuit Boards 0.2MM Thickness , 4 Layer Surface Mount PCB Assembly
 

 

Quick Details
 

PCB Type:

Flexible Printed Circuit

Layer :

4 layer

Min .Line Width/Space:

3mil/3mil

Min. Via Diameter:

0.3mm

Finish Thickness:

0.1mm

Surface Finish:

ENIG

Size:

60*100MM

Material:

PI

Color:

Gold

Application:

Mobile

 
 
Description
 
 
Shenzhen Hengda Electronics is a leading manufacturer of precision Flexible Printed Circuit (FPC) for customers worldwide. We specialize in quick-turn FPC prototypes to FPC mass productions, provide high quality and cost effective turn key solutions to our customers.
 

 
 
 
This table lists the standard flex circuits materials and material thicknesses that we may have daily available. If  the material or thickness you require is not listed, consult us. We have full specification of each material available for your required.
 
FPC Materials
 

Material Function

Material Type

Options

Flexible Insulator

Polyimide(PI)

1/2 mil to 5 mil

Conductor

Copper  
 *Rolled Annealed(RA)  *Electrodeposited(ED)

1/4 oz(0.009mm)                                 to 10 oz(0.356mm)

Rigid Substrate  (Rigid-Flex)

FR-4

3 mil to 125 mil

Adhesive

Acrylic Adhesive

1/2 mil to 3 mil

Adhesiveless Material also available 

Stiffener

FR-4                               Polyimide(PI)               Polyester(PET)              Adhesivetape   Steel/Aluminum/Copper     

3mil to 125 mil                                     1/2 mil to 5mil                                     1 mil to 15mil                                        6 mil

Solder Mask

Polyimide(PI)                   Photoimageable Coverlay  Liquid Photoimageable Covercoat

1/2 mil to 5 mil                                     1 mil to 2.5 mil Liquid Typically for surface mount and dense applications

Surface Finish Options

Tin

Immersion Tin

Gold

Electrolytic Nickel Immersion Gold     Electrolytic Hard Nickel /Gold       Electrolytic Soft Nickel/Gold

Silver

Immersion Silver

OSP

OSP

Shielding

Solid Copper         Crosshatched Copper Conductive Silver                       Aluminum 

Required To Limited Electromagnetic and/or Electrostatic

 
 
 
FPC Standard Structure
 
 
 
 
Technical Capabilities
 

Layer (Max)

Up to 8 Layers

Board Size (Max)

500*1000mm

Outer tolerance

a+/-0.2mm Hand Trim
b+/-0.25mm steel Rule Dies
c+/-0.07mm Punch and Dies
d+/-0.025 Laser Cut

Hole 

Diameter(Min)

0.1mm(Finished)

 

Diameter Tolerance

a.Plating Through Holes+/-0.08mm  b.Non-Plating Through Holes+/-0.05mm 

 

Drill Position Tolerance 

+/-0.076mm

Conductor

Width Tolerance

+/-15%

Spacing(Min)

2mil

Spacing Tolerance

+/-15%

Pad

Pad(Non-Wiring)

>=0.04mm+ Hole 

Pad(Wiring)

>=0.3mm+Hole

Coverlay

Coverlay to Pad(Min)

100um

Coverlay to Conductor (Min)

100um

Coverlay Width(Min)

250um

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Company Info

Shenzhen Hengda Electronics Limited [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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