Electronic Flexible PCB Prototype Design For Mobile Phone Liquid Solder Mask Flexible printed circuit-11 manufacturer from China Shenzhen Hengda Electronics Limited

Electronic Flexible PCB Prototype Design For Mobile Phone Liquid Solder Mask

Place of Origin:

Zhejiang, China (Mainland)


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Product Detail

Model No.: Flexible printed circuit-11

Electronic Flexible PCB Prototype Design For Mobile Phone Liquid Solder Mask

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Electronic Flexible PCB Prototype Design For Mobile Phone Liquid Solder Mask

Quick Details

PCB Type:	Flexible Printed Circuit
Layer :	2 layer
Min .Line Width/Space:	3mil/3mil
Min. Via Diameter:	0.3mm
Finish Thickness:	0.1mm
Surface Finish:	ENIG
Size:	60*100MM
Material:	PI
Color:	Gold
Application:	Mobile

Description

Shenzhen Hengda Electronics is a leading manufacturer of precision Flexible Printed Circuit (FPC) for customers worldwide. We specialize in quick-turn FPC prototypes to FPC mass productions, provide high quality and cost effective turn key solutions to our customers.

This table lists the standard flex circuits materials and material thicknesses that we may have daily available. If the material or thickness you require is not listed, consult us. We have full specification of each material available for your required.

FPC Materials

Material Function	Material Type	Options
Flexible Insulator	Polyimide(PI)	1/2 mil to 5 mil
Conductor	Copper Rolled Annealed(RA) Electrodeposited(ED)	1/4 oz(0.009mm) to 10 oz(0.356mm)
Rigid Substrate (Rigid-Flex)	FR-4	3 mil to 125 mil
Adhesive	Acrylic Adhesive	1/2 mil to 3 mil
Adhesive	Adhesiveless Material also available
Stiffener	FR-4 Polyimide(PI) Polyester(PET) Adhesivetape Steel/Aluminum/Copper	3mil to 125 mil 1/2 mil to 5mil 1 mil to 15mil 6 mil
Solder Mask	Polyimide(PI) Photoimageable Coverlay Liquid Photoimageable Covercoat	1/2 mil to 5 mil 1 mil to 2.5 mil Liquid Typically for surface mount and dense applications
Surface Finish Options	Tin	Immersion Tin
	Gold	Electrolytic Nickel Immersion Gold Electrolytic Hard Nickel /Gold Electrolytic Soft Nickel/Gold
	Silver	Immersion Silver
	OSP	OSP
Shielding	Solid Copper Crosshatched Copper Conductive Silver Aluminum	Required To Limited Electromagnetic and/or Electrostatic

FPC Standard Structure

Technical Capabilities

Layer (Max)	Up to 8 Layers
Board Size (Max)	500*1000mm
Outer tolerance	a+/-0.2mm Hand Trim b+/-0.25mm steel Rule Dies c+/-0.07mm Punch and Dies d+/-0.025 Laser Cut
Hole	Diameter(Min)	0.1mm(Finished)
	Diameter Tolerance	a.Plating Through Holes+/-0.08mm b.Non-Plating Through Holes+/-0.05mm
	Drill Position Tolerance	+/-0.076mm
Conductor	Width Tolerance	+/-15%
	Spacing(Min)	2mil
	Spacing Tolerance	+/-15%
Pad	Pad(Non-Wiring)	>=0.04mm+ Hole
Pad	Pad(Wiring)	>=0.3mm+Hole
Coverlay	Coverlay to Pad(Min)	100um
	Coverlay to Conductor (Min)	100um
	Coverlay Width(Min)	250um
Stiffener holes Mr. Grace Tel: 86-755-23140032 Contact to this supplier Related Search Red Solder Mask Pcb Pcb Mobile Phone Solder Mask Prototype Pcb Assembly Fr4 Pcb White Solder Peelable Mask Pcb More>> Find more related products in following catalogs on Hisupplier.com Electronic & Electrical >> Generators >> Gas Generators × Company Info Shenzhen Hengda Electronics Limited [China (Mainland)] Business Type:Manufacturer City: Shenzhen Province/State: Guangdong Country/Region: China (Mainland) View Contact Details You May Like: prev 1.6mm Double Layer PCB Building Circuit ... Custom Blue Double Sided PCB Board Manuf... Fast Batch Double Sided PCB ENIG Finish ... USB Double Sided PCB Circuits Panel Imme... Quick Turn Circuits Double Layer PCBFR4 ... Red Double Sided Board Manufacturing SMT... Rigid Power Double Side PCB Electrical C... Soldering Doubled Side PCB Fabrication ,... PCB Double Layer Printed Wiring Board Ha... Blue Multilayer PCB Online Buried Vias P... 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