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PCB and PCB Assembly Technical Capabilities 

Place of Origin: Zhejiang, China (Mainland) 
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PCB Technical Capabiliti

PCB Technical Capabilities
 

Number of layers

1, 2, 4 or 6, upto 36 layers

Order Quantity

1 to 500,000

Board shape

Rectangular, round, slots, cutouts, complex, irregular

Board type

Rigid, flexible, rigid-flexible

Board material

FR4 glass epoxy, FR4 High Tg, RoHS compliant; Aluminum, Rogers, etc.

Board cutting

Shear, V-score, tab-routed

Board thickness

Flex, 0.2 ~ 6.0 mm, 0.01 ~ 0.25″

Copper weight

1.0, 1.5, 2.0 Oz

Solder mask

Double-sided green LPI, Also support red, white, yellow, blue, black

Silk screen

Double-sided or single-sided in white, yellow, black, or negative

Silk screen min line width

0.006″ or 0.15mm

Max board dimensions

45 x 45″ or 114 x 114 cm

Min trace/gap

0.004”, 0.1mm, or 4 mils

Min drill hole diameter

0.006”, 0.15mm, or 6 mils

Surface finish

HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.

Board thickness tolerance

±10%

Copper weight tolerance

±0.25 oz

Minimal slot width

0.12”, 3.0 mm, or 120 mils

V-score depth

20-25% of board thickness

Plated through holes

Yes

Sink holes

Yes

Design file format

Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG

 

 

 

PCB Assembly Technical Capabilities

 

Type of assembly

THD (Thru-hole device) / Conventional
SMT (Surface-mount technology)
SMT  & THD mixed
Double-sided SMT and/or THD assembly

Order quantity

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Company Info

Shenzhen Hengda Electronics Limited [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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