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Production HDI PCB Design 3 Level Gold Finger Finish With Laser Pits 

Place of Origin: Zhejiang, China (Mainland) 
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Product Detail

Model No.: HDI PCB-5

 
Production HDI PCB Design 3 Level Gold Finger Finish With Laser Pits
 
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Production HDI PCB Design 3 Level Gold Finger Finish With Laser Pits

 

Quick Details 

 

PCB Type:

HDI PCB

Layer :

8 layer

Min .Line Width/Space:

3mil/3mil

Min. Via Diameter:

0.3mm

Finish Thickness:

1.6mm

Surface Finish:

Gold Finger

Size:

120*150MM

Material:

FR-4 

Color:

Green

Application:

Computer

 

 

Description

 

    

We have a professional HDI (high density interconnect) circuit board manufacturing base; we attach importance to HDI technology R&D to satisfy customer's HDI technology requirements.      

 

The HDI PCBs we offer include the following highly requested characteristics:

 

  • Blind and/or buried vias
  • Via-in-pad
  • Through vias from surface to surface
  • 20 um circuit geometries
  • 30 um dielectric layers
  • 50 um laser vias
  • 125 um bump pitch processing

 

Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.

 

 

 

 

 

Below is our latest Any layer HDI technology:

 

 

 

Technical Capabilities

 

Number of layers

1, 2, 4 or 6, up  to 36 layers

Order Quantity

1 to 500,000

Board shape

Rectangular, round, slots, cutouts, complex, irregular

Board type

Rigid, flexible, rigid-flexible

Board material

FR4 glass epoxy, FR4 High Tg, RoHS compliant; Aluminum, Rogers, etc.

Board cutting

Shear, V-score, tab-routed

Board thickness

Flex, 0.2 ~ 6.0 mm, 0.01 ~ 0.25″

Copper weight

1.0, 1.5, 2.0 Oz

Solder mask

Double-sided green LPI, Also support red, white, yellow, blue, black

Silk screen

Double-sided or single-sided in white, yellow, black, or negative

Silk screen min line width

0.006″ or 0.15mm

Max board dimensions

45 x 45″ or 114 x 114 cm

Min trace/gap

0.004”, 0.1mm, or 4 mils

Min drill hole diameter

0.006”, 0.15mm, or 6 mils

Surface finish

HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.

Board thickness tolerance

±10%

Copper weight tolerance

±0.25 oz

Minimal slot width

0.12”, 3.0 mm, or 120 mils

V-score depth

20-25% of board thickness

Plated through holes

Yes

Sink holes

Yes

Design file format

Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG

 

 

 

PCB Production Flow Chart

 

 

Testing Procedures

 

We perform multiple quality assurance procedures before shipping out any PCB board. These include:

  • Visual Inspection
  • Flying probe
  • Bed of nails
  • Impedance control
  • Solder-ability detection
  • Digital metallograghic microscope
  • AOI (Automated Optical Inspection)

 

Quick turn lead times

 

For HDI PCB production, we can provid 7 to10 days turn around times. For multilayer PCBs, the fastestturnaround time depends on the number of layers and quantity.

 

Service Guarantee

 

We make sure to serve each customer professionally, truthfully and friendly to the best of our ability.   We will gladly re-work your project if your project isn’t 100% satisfactory.

 

 

Get a quick quote now

 

By sending in a bill of material, gerber files including assembly drawing and we will have a quotation back to you within hours. With Shenzhen hengda there is never a hidden cost and our prices are very competitive and reasonable.

 

 

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 Mr. Grace

Tel: 86-755-23140032
Contact to this supplier

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Company Info

Shenzhen Hengda Electronics Limited [China (Mainland)]


Business Type:Manufacturer
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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